Thermal imaging cores M10-256 Split-type
♦ Muchidimbu
M10-256 split-type ndeye micro infrared thermal imaging module yechizvarwa chazvino, ine diki diki nekuda kweiyo yakakwirira density yakabatanidzwa yedunhu dhizaini.Iyo module inotora yakapatsanurwa-mhando dhizaini, iyo lenzi uye interface bhodhi yakabatana netambo yakatsetseka, pamwe newafer-giredhi vanadium oxide detector ine yakaderera simba rekushandisa.Iyo module inosanganiswa ne 3.2mm lens uye shutter, ine USB interface board, saka inogona kuvandudzwa kuita zvishandiso zvakasiyana.Kudzora protocol kana SDK inopihwawo yekuvandudza kwechipiri.
♦Product Features
Saizi diki, ine lenzi yekumberi chete (13 * 13 * 8) mm uye bhodhi rekubatanidza re (23.5 * 15.3) mm.
Kushandisa simba kwakaderera kusvika ku640mW;
Chisarudzo che 256 * 192 chinopa mufananidzo wepamusoro wekupisa;
Yakashongedzerwa ne USB interface board, inogona kuvandudzwa kuita zvigadzirwa zvakasiyana;
Split-type dhizaini inogamuchirwa kune lens uye interface board, iyo yakabatana neFPC flat tambo;
| Product specification | Parameters | Product specification | Parameters |
| Rudzi rwe detector | Vanadium oxide isina kunyura infrared focal ndege | Resolution | 256* 192 |
| Spectral range | 8-14um | Tembiricha yekuyera kureba | -15 ℃-600 ℃ |
| Pixel spacing | 12um | Tembiricha yekuyera kurongeka | ± 2 ℃ kana ± 2% yekuverenga, chero yakakura |
| NETD | ＜50mK @25℃ | Voltage | 5V |
| Frame frequency | 25Hz | Lens parameters | 3.2mm F/1.1 |
| Kururamisa kusina chinhu | Support | Focus mode | Fixed focus |
| Kushanda tembiricha | -10 ℃-75 ℃ | Interface board size | 23.5mm*x15.)mm |
| Kurema | <10g | Tembiricha calibration | Secondary calibration inopiwa |
| Interface | USB |
